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ISL83220E
TM
Data Sheet
September 2001
File Number
6011.1
+/-15kV ESD Protected, +3V to +5.5V, 1Microamp, 250kbps, RS-232 Transmitters/Receivers
The Intersil ISL83220E is a 3.0V to 5.5V powered RS-232 transmitter/receiver which meets ElA/TIA-232 and V.28/V.24 specifications, even at VCC = 3.0V. Additionally, it provides 15kV ESD protection (IEC 1000-4-2 Air Gap and Human Body Model) on transmitter outputs and receiver inputs (RS-232 pins). Targeted applications are PDAs, Palmtops, and notebook and laptop computers where the low operational, and even lower standby, power consumption is critical. Efficient on-chip charge pumps, coupled with a manual powerdown function, reduce the standby supply current to a 1A trickle. Small footprint packaging, and the use of small, low value capacitors ensure board space savings as well. Data rates greater than 250kbps are guaranteed at worst case load conditions. This family is fully compatible with 3.3V only systems, mixed 3.3V and 5.0V systems, and 5.0V only systems. Table 1 summarizes the features of the ISL83320E, while Application Note AN9863 summarizes the features of each device comprising the ICL32XXE 3V family.
Features
* ESD Protection for RS-232 I/O Pins to 15kV (IEC1000) * Drop in Replacement for SP3220E * Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V * Interoperable with RS-232 down to VCC = 2.7V * Latch-Up Free * On-Chip Voltage Converters Require Only Four External 0.1F Capacitors * Manual Powerdown Feature with Receivers Active * Separate Receiver Enable Pin * RX and TX Hysteresis For Improved Noise Immunity * Guaranteed Minimum Data Rate . . . . . . . . . . . . . 250kbps * Guaranteed Minimum Slew Rate . . . . . . . . . . . . . . . 6V/s * Wide Power Supply Range . . . . . . . Single +3V to +5.5V * Low Supply Current in Powerdown State. . . . . . . . . . . 1A
itle L32 E, L32 E, L32 E, L32 E, L32 E, L32 E) bt kV D ted, V to .5V, icro p, 0kbp S2 nsts/Re v) utho ) eyrds
Applications
* Any System Requiring RS-232 Communication Ports - Battery Powered, Hand-Held, and Portable Equipment - Laptop Computers, Notebooks, Palmtops - Modems, Printers and other Peripherals - Digital Cameras - Cellular/Mobile Phones
Related Literature
* Technical Brief TB363 "Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)"
TABLE 1. SUMMARY OF FEATURES PART NUMBER ISL83220E NO. OF NO. OF Tx. Rx. 1 1 NO. OF MONITOR Rx. (R OUTB) 0 DATA RATE (kbps) 250 Rx. ENABLE FUNCTION? YES READY OUTPUT? NO MANUAL POWERDOWN? YES AUTOMATIC POWERDOWN FUNCTION? NO
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Americas Inc. | Copyright (c) Intersil Americas Inc. 2001
ISL83220E Ordering Information
(NOTE 1) PART NO. ISL83220ECB ISL83220EIB ISL83220ECA ISL83220EIA ISL83220ECV ISL83220EIV NOTE: 1. Most surface mount devices are available on tape and reel; add "-T" to suffix. TEMP. RANGE ( oC) 0 to 70 -40 to 85 0 to 70 -40 to 85 0 to 70 -40 to 85 PACKAGE 16 Ld SOIC 16 Ld SOIC 16 Ld SSOP 16 Ld SSOP 16 Ld TSSOP 16 Ld TSSOP PKG. NO. M16.3 M16.3 M16.209 M16.209 M16.173 M16.173
Pinout
ISL83220E (SOIC, SSOP, TSSOP) TOP VIEW
EN 1 C1+ 2 V+ 3 C1- 4 C2+ 5 C2- 6 V- 7 R1IN 8 16 SHDN 15 VCC 14 GND 13 T1OUT 12 N.C. 11 T1IN 10 N.C. 9 R1OUT
Pin Descriptions
PIN VCC V+ VGND C1+ C1C2+ C2TIN TOUT RIN ROUT EN SHDN N.C. System power supply input (3.0V to 5.5V). Internally generated positive transmitter supply (+5.5V). Internally generated negative transmitter supply (-5.5V). Ground connection. External capacitor (voltage doubler) is connected to this lead. External capacitor (voltage doubler) is connected to this lead. External capacitor (voltage inverter) is connected to this lead. External capacitor (voltage inverter) is connected to this lead. TTL/CMOS compatible transmitter Inputs. 15kV ESD Protected, RS-232 level (nominally 5.5V) transmitter outputs. 15kV ESD Protected, RS-232 compatible receiver inputs. TTL/CMOS level receiver outputs. Active low receiver enable control; doesn't disable ROUTB outputs. Active low input shuts down transmitters and on-board power supply, to place device in low power mode. No internal connection. FUNCTION
Typical Operating Circuit
ISL83220E
+3.3V + 0.1F 15 VCC 3 V+ V- 7 T1 13 + C3 0.1F C4 + 0.1F T1OUT RS-232 LEVELS
C1 0.1F C2 0.1F
2 + C1+ 4 C15 + C2+ 6 C211
T1IN TTL/CMOS LOGIC LEVELS R1OUT
9 R1 1 EN 5k
8
R1 IN
16 GND 14 SHDN
VCC
2
ISL83220E
Absolute Maximum Ratings
VCC to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V Input Voltages TIN, EN, SHDN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25V Output Voltages TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.2V ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to V CC +0.3V Short Circuit Duration TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Information
Thermal Resistance (Typical, Note 2)
JA (oC/W)
16 Ld Wide SOIC Package . . . . . . . . . . . . . . . . . . . 100 16 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 135 16 Ld TSSOP Package . . . . . . . . . . . . . . . . . . . . . . 145 Moisture Sensitivity (see Technical Brief TB363) All Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1 Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC (Lead Tips Only)
Operating Conditions
Temperature Range ISL83220ECX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC ISL83220EIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: 2. JA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Test Conditions: VCC = 3V to 5.5V, C1 - C4 = 0.1F; Unless Otherwise Specified. Typicals are at TA = 25oC TEST CONDITIONS TEMP (oC) MIN TYP MAX UNITS
PARAMETER DC CHARACTERISTICS Supply Current Supply Current, Powerdown
All Outputs Unloaded, SHDN = VCC SHDN = GND
VCC = 3.15V
25 25
-
0.3 1.0
1.0 10
mA A
LOGIC AND TRANSMITTER INPUTS AND RECEIVER OUTPUTS Input Logic Threshold Low Input Logic Threshold High TIN, EN, SHDN TIN, EN, SHDN VCC = 3.3V VCC = 5.0V Transmitter Input Hysteresis Input Leakage Current Output Leakage Current Output Voltage Low Output Voltage High TRANSMITTER OUTPUTS Output Voltage Swing Output Resistance Output Short-Circuit Current Output Leakage Current RECEIVER INPUTS Input Voltage Range Input Threshold Low VCC = 3.3V VCC = 5.0V Full Full Full -25 0.6 0.8 1.2 1.5 25 V V V All Transmitter Outputs Loaded with 3k to Ground VCC = V+ = V- = 0V, Transmitter Output = 2V VOUT = 0V VOUT = 12V, VCC = 0V or 3V to 5.5V, SHDN = GND Full Full Full Full 5.0 300 5.4 10M 35 60 25 V mA A TIN, EN, SHDN EN = VCC IOUT = 1.6mA IOUT = -1.0mA Full Full Full 25 Full Full Full Full 2.0 2.4 0.3 0.01 0.05 1.0 10 0.4 0.8 V V V V A A V V
VCC -0.6 VCC -0.1
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ISL83220E
Electrical Specifications
Test Conditions: VCC = 3V to 5.5V, C1 - C4 = 0.1F; Unless Otherwise Specified. Typicals are at TA = 25oC (Continued) TEST CONDITIONS VCC = 3.3V VCC = 5.0V Input Hysteresis Input Resistance TIMING CHARACTERISTICS Maximum Data Rate Transmitter Propagation Delay RL = 3k, C L = 1000pF, One Transmitter Switching Transmitter Input to Transmitter Output, RL = 3k, C L = 1000pF Receiver Input to Receiver Output, CL = 150pF Normal Operation Normal Operation tPHL - tPLH (Note 3) tPHL - tPLH CL = 150pF to 2500pF VCC = 3.3V, RL = 3k to 7k, CL = 150pF to 1000pF Measured From 3V to -3V or -3V to 3V tPHL tPLH tPHL tPLH Full 25 25 25 25 25 25 25 Full 25 25 250 4 6 500 1.0 1.0 0.20 0.30 200 200 100 100 500 1000 30 30 kbps s s s s ns ns ns ns V/s V/s TEMP (oC) Full Full 25 Full MIN 3 TYP 1.5 1.8 0.3 5 MAX 2.4 2.4 7 UNITS V V V k
PARAMETER Input Threshold High
Receiver Propagation Delay
Receiver Output Enable Time Receiver Output Disable Time Transmitter Skew Receiver Skew Transition Region Slew Rate
ESD PERFORMANCE RS-232 Pins (TOUT, RIN) Human Body Model IEC1000-4-2 Contact Discharge IEC1000-4-2 Air Gap Discharge All Other Pins NOTE: 3. Transmitter skew is measured at the transmitter zero crossing points. Human Body Model 25 25 25 25 15 8 15 3 kV kV kV kV
Detailed Description
The ISL83220E operates from a single +3V to +5.5V supply, guarantees a 250kbps minimum data rate, requires only four small external 0.1F capacitors, features low power consumption, and meets all ElA RS-232C and V.28 specifications. The circuit is divided into three sections: The charge pump, the transmitter, and the receiver.
Transmitters
The transmitters are proprietary, low dropout, inverting drivers that translate TTL/CMOS inputs to EIA/TIA-232 output levels. Coupled with the on-chip 5.5V supplies, these transmitters deliver true RS-232 levels over a wide range of single supply system voltages. The transmitter output disables and assumes a high impedance state when the device enters the powerdown mode (see Table 2). This output may be driven to 12V when disabled. All devices guarantee a 250kbps data rate for full load conditions (3k and 1000pF), VCC 3.0V. Under more typical conditions of VCC 3.3V, RL = 3k, and CL = 250pF, the ISL83220E easily operates at 900kbps. Transmitter inputs float if left unconnected, and may cause ICC increases.
Charge-Pump
Intersil's new 3.3V family utilizes regulated on-chip dual charge pumps as voltage doublers, and voltage inverters to generate 5.5V transmitter supplies from a VCC supply as low as 3.0V. This allows these devices to maintain RS-232 compliant output levels over the 10% tolerance range of 3.3V powered systems. The efficient on-chip power supplies require only four small, external 0.1F capacitors for the voltage doubler and inverter functions, even at VCC = 3.3V. The charge pumps operate discontinuously (i.e., they turn off as soon as the V+ and V- supplies are pumped up to the nominal values), resulting in significant power savings. 4
ISL83220E
Receivers
The ISL83220E device contains a standard inverting receiver that three-states via the EN control line. Receivers convert RS-232 signals to CMOS output levels and accept inputs up to 25V while presenting the required 3k to 7k input impedance (see Figure 1) even if the power is off (VCC = 0V). The receiver's Schmitt trigger input stage uses hysteresis to increase noise immunity and decrease errors due to slow input signal transitions. The ISL83220E receiver disables only when EN is driven high. (see Table 2). This allows the receiver to monitor external devices, like a modem, even when the ISL83220E is in its 1A powerdown state. Standard receivers driving powered down peripherals must be disabled to prevent current flow through the peripheral's protection diodes (see Figures 2). This renders them useless for wake up functions.
VCC R1IN -25V VRIN +25V GND Rx 5k R1OUT GND VROUT VCC VOUT = VCC VCC
section). The time to recover from manual powerdown mode is typically 100s.
TABLE 2. POWERDOWN AND ENABLE LOGIC TRUTH TABLE SHDN EN TRANSMITTER RECEIVER INPUT INPUT OUTPUT OUTPUT L L L H High-Z High-Z Active High-Z MODE OF OPERATION Manual Powerdown Manual Powerdown w/Rcvr. Disabled Normal Operation Normal Operation w/Rcvr. Disabled
H H
L H
Active Active
Active High-Z
VCC
VCC CURRENT FLOW
FIGURE 1. INVERTING RECEIVER CONNECTIONS
POWERED DOWN UART Tx GND SHDN = GND OLD RS-232 CHIP
Operation down to 2.7V
ISL83220E transmitter outputs meet RS-562 levels (3.7V) with VCC as low as 2.7V. RS-562 levels typically ensure inter operability with RS-232 devices.
Powerdown Functionality
This 3V family of RS-232 interface devices requires a nominal supply current of 0.3mA during normal operation (not in powerdown mode), which is considerably less than the 5mA to 11mA current required of 5V RS-232 devices. The already low current requirement drops significantly when the device enters powerdown mode. In powerdown, supply current drops to 1A, because the on-chip charge pump turns off (V+ collapses to VCC, V- collapses to GND), and the transmitter outputs three-state. This micro-power mode makes these devices ideal for battery powered and portable applications.
FIGURE 2. POWER DRAIN THROUGH POWERED DOWN PERIPHERAL
Receiver ENABLE Control
The ISL83220E also features an EN input to control the receiver output. Driving EN high disables the receiver output placing it in a high impedance state. This is useful to eliminate supply current, due to a receiver output forward biasing the protection diode, when driving the input of a powered down (VCC = GND) peripheral (see Figure 2).
Capacitor Selection
The charge pumps require 0.1F capacitors for 3.3V operation. Do not use values smaller than 0.1F. Increasing the capacitor values (by a factor of 2) reduces ripple on the transmitter outputs and slightly reduces power consumption. When using minimum required capacitor values, make sure that capacitor values do not degrade excessively with temperature. If in doubt, use capacitors with a larger nominal value. The capacitor's equivalent series resistance (ESR) usually rises at low temperatures and it influences the amount of ripple on V+ and V-.
Software Controlled (Manual) Powerdown
On the ISL83220E, the powerdown control is via a simple shutdown (SHDN) pin. Driving this pin high enables normal operation, while driving it low forces the IC into it's powerdown state. Connect SHDN to VCC if the powerdown function isn't needed. Note that the receiver output remains enabled during shutdown (see Table 2). For the lowest power consumption during powerdown, the receiver should also be disabled by driving the EN input high (see next
5
ISL83220E Power Supply Decoupling
In most circumstances a 0.1F bypass capacitor is adequate. In applications that are particularly sensitive to power supply noise, decouple V CC to ground with a capacitor of the same value as the charge-pump capacitor C1. Connect the bypass capacitor as close as possible to the IC.
VCC 0.1F +
+ C1
C1+ C1-
VCC
V+
+ C3
ISL83220E
Transmitter Output when Exiting Powerdown
Figure 3 shows the response of the transmitter output when exiting powerdown mode. As it activates, the transmitter output properly goes to RS-232 levels, with no glitching, ringing, nor undesirable transients. The transmitter is loaded with 3k in parallel with 2500pF. Note that the transmitter enables only when the magnitude of the supplies exceed approximately 3V.
+ C2
C2+ C2TIN ROUT EN TOUT
V-
C4 +
RIN 5k
1000pF
VCC
SHDN
FIGURE 4. TRANSMITTER LOOPBACK TEST CIRCUIT
5V/DIV. SHDN TIN = LOW 5V/DIV. T1IN
2V/DIV. T1OUT
TIN = HIGH VCC = +3.3V C1 - C4 = 0.1F TIME (20s/DIV.) R1OUT VCC = +3.3V C1 - C4 = 0.1F 5s/DIV.
FIGURE 3. TRANSMITTER OUTPUT WHEN EXITING POWERDOWN
High Data Rates
The ISL83220E maintains the RS-232 5V minimum transmitter output voltages even at high data rates. Figure 4 details a transmitter loopback test circuit, and Figure 5 illustrates the loopback test result at 120kbps. For this test, the transmitter is driving an RS-232 load in parallel with 1000pF, at 120kbps. Figure 6 shows the loopback results for the transmitter driving 1000pF and an RS-232 load at 250kbps.
5V/DIV. T1IN
FIGURE 5. LOOPBACK TEST AT 120kbps
T1OUT
R1OUT VCC = +3.3V C1 - C4 = 0.1F 2s/DIV.
FIGURE 6. LOOPBACK TEST AT 250kbps
6
ISL83220E Interconnection with 3V and 5V Logic
The ISL83220E directly interfaces with 5V CMOS and TTL logic families. Nevertheless, with the ISL83220E at 3.3V, and the logic supply at 5V, AC, HC, and CD4000 outputs can drive ISL83220E inputs, but ISL83220E outputs do not reach the minimum V IH for these logic families. See Table 3 for more information.
TABLE 3. LOGIC FAMILY COMPATIBILITY WITH VARIOUS SUPPLY VOLTAGES VCC SYSTEM POWER-SUPPLY SUPPLY VOLTAGE VOLTAGE (V) (V) 3.3 5 5 3.3 5 3.3
current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the HBM test. The extra ESD protection built into this device's RS-232 pins allows the design of equipment meeting level 4 criteria without the need for additional board level protection on the RS-232 port. AIR-GAP DISCHARGE TEST METHOD For this test method, a charged probe tip moves toward the IC pin until the voltage arcs to it. The current waveform delivered to the IC pin depends on approach speed, humidity, temperature, etc., so it is difficult to obtain repeatable results. The "E" device RS-232 pins withstand 15kV air-gap discharges. CONTACT DISCHARGE TEST METHOD During the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. The result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than 8kV. All "E" family devices survive 8kV contact discharges on the RS-232 pins.
COMPATIBILITY Compatible with all CMOS families. Compatible with all TTL and CMOS logic families. Compatible with ACT and HCT CMOS, and with TTL. ISL83320E outputs are incompatible with AC, HC, and CD4000 CMOS inputs.
15kV ESD Protection
All pins on ISL8XXX devices include ESD protection structures, but the ISL8XXXE family incorporates advanced structures which allow the RS-232 pins (transmitter outputs and receiver inputs) to survive ESD events up to 15kV. The RS-232 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, protect without allowing any latchup mechanism to activate, and don't interfere with RS-232 signals as large as 25V.
Human Body Model (HBM) Testing
As the name implies, this test method emulates the ESD event delivered to an IC during human handling. The tester delivers the charge through a 1.5k current limiting resistor, making the test less severe than the IEC-1000 test which utilizes a 330 limiting resistor. The HBM method determines an ICs ability to withstand the ESD transients typically present during handling and manufacturing. Due to the random nature of these events, each pin is tested with respect to all other pins. The RS-232 pins on "E" family devices can withstand HBM ESD events to 15kV.
IEC1000-4-2 Testing
The IEC 1000 test method applies to finished equipment, rather than to an individual IC. Therefore, the pins most likely to suffer an ESD event are those that are exposed to the outside world (the RS-232 pins in this case), and the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. The lower
7
ISL83220E
Typical Performance Curves
6 TRANSMITTER OUTPUT VOLTAGE (V) 4 2 TRANSMITTER AT 250kbps 0 -2 -4 -6
VCC = 3.3V, TA = 25oC
25 VOUT+ 20 SLEW RATE (V/s)
15 -SLEW +SLEW 10
VOUT 5
0
1000
2000
3000
4000
5000
0
1000
2000
3000
4000
5000
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
FIGURE 7. TRANSMITTER OUTPUT VOLTAGE vs LOAD CAPACITANCE
FIGURE 8. SLEW RATE vs LOAD CAPACITANCE
3.5 45 40 SUPPLY CURRENT (mA) 35 30 25 20 15 10 5 0 0 1000 2000 3000 4000 5000 LOAD CAPACITANCE (pF) 0 2.5 3.0 3.5 4.0 4.5 20kbps 120kbps SUPPLY CURRENT (mA) 250kbps 3.0 2.5 2.0 1.5 1.0 0.5
NO LOAD ALL OUTPUTS STATIC
5.0
5.5
6.0
SUPPLY VOLTAGE (V)
FIGURE 9. SUPPLY CURRENT vs LOAD CAPACITANCE WHEN TRANSMITTING DATA
FIGURE 10. SUPPLY CURRENT vs SUPPLY VOLTAGE
Die Characteristics
DIE DIMENSIONS: 100 mils x 100 mils (2540m x 2540m) METALLIZATION: Type: Metal 1: AISi(1%) Thickness: Metal 1: 8kA Type: Metal 2: AISi (1%) Thickness: Metal 2: 10kA SUBSTRATE POTENTIAL (POWERED UP): GND PASSIVATION: Type: Silox Thickness: 13kA TRANSISTOR COUNT: 286 PROCESS: Si Gate CMOS
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ISL83220E Thin Shrink Small Outline Plastic Packages (TSSOP)
N INDEX AREA E E1 -B1 2 3 L 0.05(0.002) -AD -CSEATING PLANE A 0.25 0.010 GAUGE PLANE 0.25(0.010) M BM
M16.173
16 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1 A2 b c D MIN 0.002 0.031 0.0075 0.0035 0.193 0.169 MAX 0.047 0.006 0.051 0.0118 0.0079 0.201 0.177 MILLIMETERS MIN 0.05 0.80 0.19 0.09 4.90 4.30 MAX 1.20 0.15 1.05 0.30 0.20 5.10 4.50 NOTES 9 3 4 6 7 8o Rev. 0 6/98
A1 0.10(0.004) A2 c
E1 e E L N
e
b 0.10(0.004) M C AM BS
0.026 BSC 0.246 0.0177 16 0o 8o 0.256 0.0295
0.65 BSC 6.25 0.45 16 0o 6.50 0.75
NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-153-AB, Issue E. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E1" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of "b" dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees)
9
ISL83220E Small Outline Plastic Packages (SSOP)
N INDEX AREA E -B1 2 3 L SEATING PLANE -AD -CA 0.25 0.010 GAUGE PLANE H 0.25(0.010) M BM
M16.209 (JEDEC MO-150-AC ISSUE B) 16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INCHES SYMBOL A A1 A2 B C D MIN 0.002 0.065 0.009 0.004 0.233 0.197 MAX 0.078 0.072 0.014 0.009 0.255 0.220 MILLIMETERS MIN 0.05 1.65 0.22 0.09 5.90 5.00 MAX 2.00 1.85 0.38 0.25 6.50 5.60 NOTES 9 3 4 6 7 8o Rev. 2 3/95

A1 0.10(0.004) A2 C
E e H L N
e
B 0.25(0.010) M C AM BS
0.026 BSC 0.292 0.022 16 0o 8o 0.322 0.037
0.65 BSC 7.40 0.55 16 0o 8.20 0.95
NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension "B" does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of "B" dimension at maximum material condition. 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
10
ISL83220E Small Outline Plastic Packages (SOIC)
N INDEX AREA E -B1 2 3 SEATING PLANE -AD -CA h x 45o H 0.25(0.010) M BM
M16.3 (JEDEC MS-013-AA ISSUE C)
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A
L
MILLIMETERS MIN 2.35 0.10 0.33 0.23 10.10 7.40 MAX 2.65 0.30 0.51 0.32 10.50 7.60 NOTES 9 3 4 5 6 7 8o Rev. 0 12/93
MIN 0.0926 0.0040 0.013 0.0091 0.3977 0.2914
MAX 0.1043 0.0118 0.0200 0.0125 0.4133 0.2992
A1 B C D E

A1 0.10(0.004) C
e H h L N
0.050 BSC 0.394 0.010 0.016 16 0o 8o 0.419 0.029 0.050
1.27 BSC 10.00 0.25 0.40 16 0o 10.65 0.75 1.27
e
B 0.25(0.010) M C AM BS
NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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